Reflow Soldering
Apparatus and Heat Transfer Processes
Reflow Soldering: Apparatus and Heat Transfer Processes investigates the technology of reflow soldering from the aspect of the soldering ovens and apparatus. The authors begin by introducing the concept of surface mount technology. Les mer
2574,-
Paperback
Utsolgt
Reflow Soldering: Apparatus and Heat Transfer Processes investigates the technology of reflow soldering from the aspect of the soldering ovens and apparatus. The authors begin by introducing the concept of surface mount technology. This is followed by three chapters exploring: Infrared ovens, convection ovens, Vapor Phase Soldering (VPS), and special reflow ovens. Each of these chapters includes a discussion of the physical background, structure and working principle, and characterization of the heating, flow and vapor parameters; and concludes with a review of the application of the techniques and typical solder failures. The book concludes with a discussion of the various numerical simulations of the different ovens. This book will be useful for researchers and process and quality and research and design engineers within the electronics and manufacturing industries.
Detaljer
- Forlag
- Elsevier Science Publishing Co Inc
- Innbinding
- Paperback
- Språk
- Engelsk
- ISBN
- 9780128185056
- Utgivelsesår
- 2020
- Format
- 23 x 15 cm
Medlemmers vurdering
Skriv en vurdering
Oppdag mer
Bøker som ligner på Reflow Soldering:
Thermal Transport Characteristics of Phase Change Materials and Nanofluids
S. HarikrishnanInnbundet
2085,-